It’s week 2 of the year and CES was its main event. There weren’t many grand phone announcements at the CES floor though – in fact the most popular news of the week was the announcement of the Redmi Note 7 and Redmi’s new life as a separate brand, complete with its own logo.
Xiaomi also dropped the AirDots Pro competitor to Apple’s AirPods. We can’t speak to their design or sound quality, but their $60 price is more than half of the AirPods’ $160.
In unconfirmed Xiaomi news we saw a Xiaomi Cepheus on Geekbench, packing the next-gen Snapdragon 855 chipset – is it the Xiaomi Mi 9?
Samsung made headlines with the announcement of its February 20 Unpacked event, at which it will unleash its new trio of flagships – the Galaxy S10 Lite, Galaxy S10 and Galaxy S10 Plus.
We saw the Galaxy S10 Lite, or will it be called Galaxy S10 E, flex its Snapdragon 855 muscle on Geekbench. We also saw the Galaxy S10 design in an article, focused on Samsung’s new One UI.
The first Snapdragn 675 smartphone was revealed this week – the HiSense U30, which later made its way to Geekbench and AnTuTu, showing promising performance.
It seems HMD is planning on hopping on the punch-hole bandwagon with the upcoming Nokia 8.1 Plus. We don’t know much of the phone outside of its 6.2-inch screen size and its design, though.
We’ll see you next week!
The SM-G970U, the US model, uses a Qualcomm chip, of course, but there should an Exynos 9820 version as well.
The Cepheus will have a 48MP camera and an in-display fingerprint reader, according to recent rumors.
The punch hole camera is a dead giveaway. Samsung updated the article with a new image – without the camera and with thicker bezels.